After several weeks of detailed and less detailed leaks, Xiaomi’s Mi 6 smartphone launched at the tail end of April. Couple of months ago, we did a wild rumor article that you can read here and by looking at the final product, we can see that we were not far off. Actually, not at all. Design Let us start with the phone’s appearance. The Mi 6 leaked through and through ahead of its debut, but most of the leaks showed just the black version. The “Hero” version that Xiaomi is promoting in its official photographs and renderings is quite an elegant blue and gold combination. There
Starting today, on April 20th we’re launching a new daily section covering the latest news from the world of technology. Every day we’ll try to bring Top 10 stories for you to read and eny. We hope you’ll enjoy them. Hold on, memory will be cheaper (soon?) http://www.digitimes.com/news/a20170418PD203.html “Major NAND flash suppliers including Samsung Electronics, Micron Technology and Toshiba have rolled out 64-layer 3D NAND flash products, said the sources. SK Hynix has even introduced what the company claims is the industry’s first 72-layer 3D NAND flash chips.” Microsoft explains why the company opted against combining Polaris GPU with RYZEN CPU architecture http://www.eurogamer.net/articles/digitalfoundry-2017-the-scorpio-engine-in-depth “There are
If you would align your wristwatch to the sound of Intel’s tick tock, you would miss your important meeting. The launch of a new generation of processors represents a symbolic beginning of a new cycle and for Intel, “Kaby Lake” launch was everything but normal. First launching the Ultra-low Voltage parts (the U series), then the Desktop line-up and finally the mainstream notebook designs, with troublesome rumors about its enterprise, Xeon-branded counterpart. Kaby Lake is perhaps too focused on the processor power task rather than processor performance. A lullaby. The same story for the last six years continues. Admittedly, for the past 18 months there were whispers
Samsung Electronics, world’s largest semiconductor manufacturer (according to SIA) just won the race to 10 nanometer (10nm-class) process by launching DDR4 SDRAM memory chips which utilize the new process node. However, this ’10nm-class’ is not exactly precise 10nm, as the distance between the cells / transistors can vary between 10-19nm. If you’re in the semiconductor industry, this will not be surprising as Intel’s famous 22nm process was considered 26-28nm process. The new DDR4 memory chips come in 8Gbit (1GB) capacity, supporting the frequency of up to 3.2 GHz (1.6 GHz in DDR mode). At the same time, power consumption is reduced by 10% when compared to
AMD’s path to this moment was a difficult one. The company spent $334 million to acquire SeaMicro, an investment which was latter written off completely, and ultimately lead to shutting down the micro-server division. At the same time, 2012 saw the announcement of ARM-based Opteron and its arrival on the product roadmap (and a continuous push back), with ARM-based AMD product being available only as a single processor, 1U half-rack development kit from a third party vendor. This changes today, with the introduction of AMD Opteron A1100 Series processors, based on a silicon codenamed ‘Seattle’ – which may or may not have to do anything with two major customers from that area. In order to bring
Following the announcement of Intel Skylake-K processor for gamers and enthusiasts and the new chipset, known as the Z170 PCH (Processor Communications Hub), memory manufacturers introduced new products to support the platform. HyperX, a division of Kingston Technology Company, Inc. announced several new products optimized for Skylake. The company launched several 8GB and 16GB memory kits from the Fury family and now offers memory kits with two and four DIMM modules. Memory kits are available in low-latency 2133MHz (CL14), and CL15 versions at 2400 and 2666MHz. With Intel Core i5-6600K and i7-6700K, we are looking at very good bandwidth of 34.1GB/s for the 2133MHz, 38.4GB/s for 2400
In my 30-year career as an IT hardware expert, I’ve seen thousands of roadmaps, leaked, manage-leaked and official alike. Many were on target, yet still quite a few headed for the “failed” dustbin. Among all of them, Intel’s “tick-tock” plan was probably the most ambitious one in terms of attempted consistency and predictability. Knowing the multiple interlinked uncertainties of semiconductor process, CPU architecture, ecosystem changes and others, it was a wonder in itself that it lasted for several years, until the major slippages occurred in the Sandy Bridge generation. From then on, not only there were major delays introduced to the high end lines as the
ASRock’s Skylake-based motherboard gives us a taste of what’s to come with Intel’s sixth-generation cores.
The HyperX Predator line from Kingston is fresh on the scene and is hoping to be the choice for many enthusiasts with its competitive pricing.
MSI announces today the new MSI X99S GAMING 9 ACK, a version that has been updated with the latest Killer DoubleShot Pro.
New lineup of DDR4 memory to be targeted at Enterprise market.
Corsair’s new DDR4 Vengeance LPX 2666 CL 15 quad channel kit is reviewed. It proves to be a capable set of RAM with headroom for overclocking and tweaking.
Although there are several DDR4 kits available for X99 motherboards, most modules are clocked at 2133 MHz and 2400 MHz. G.Skill is looking to remedy that with the launch of its latest memory modules, which are clocked at 3333 MHz. Dubbed Ripjaws 4, G.Skill is looking to cater to the enthusiast segment with these modules, which will be available in quad-channel variants (4x4GB). In addition to the 3333 MHz modules, G.Skill is also launching slightly lesser clocked 3300 MHz and 3200 MHz kits in 16 GB (4x4GB) configurations. The modules feature a CL timings of 16-16-16-36, which comes out to a latency of 9.6 nanoseconds.
Back in 2003, AMD introduced the Opteron processor, world’s first 64-bit x86 processor capable of addressing more than 4GB of memory (32-bit) – no less than massive 1TB of memory, courtesy of its 40-bit allocation table. Processors of today are capable of addressing up to 8TB of SDRAM memory thanks to extended (46-bit) allocation table. However, until now, finding a high-capacity memory module with 32GB density was as rare as finding hen’s teeth and usually you would pay top dollar for it. Upcoming 20nm manufacturing process enabled the creation of ultra-dense memory modules and with SK.Hynix launching its 20nm 8Gbit memory chip, there was no
Qualcomm has been fairly quiet about their high-end ambitions after what is expected to follow the soon-to-launch Snapdragon 805 chipset. The Snapdragon 805 is Qualcomm’s chip that will likely ship in devices next quarter and is marketed by Qualcomm as their 4K chip with the Adreno 420 GPU. Now, even though the Snapdragon 805 (APQ8084) is a very powerful chip, it lacks 64-bit capability and doesn’t have an integrated modem, requiring a separate modem like Qualcomm’s 20nm MDM9x35 to enable cellular capability. It also sports an improved Krait CPU with a Krait 450 CPU compared to the Snapdragon 801 and 800’s Krait 400. However, it