fabric Archives - VR World

Today, Intel made two fairly large announcements simultaneously with the announcement of their Omni Scale Fabric and the integration of it into their next generation of Xeon Phi chips. Additionally, Intel has worked with Micron to enhance Knight’s Landing with high-performance on-package memory. This on-package memory is also known as Hybrid Memory Cube or HMC. The Knight’s Landing next generation Xeon Phi product announced today will use Intel’s Silvermont CPU architecture which is modified (or as Intel says, enhanced) for HPC. The expectation that Intel is setting is that these cores will deliver three times the single threaded performance of the previous generation and still

Last week ARM invited a group of journalists and analysts to Austin Texas to hear about their server, mobile, and wearable developments. ARM and their partners presented in-depth explanations of their version of the ARM architecture. On the first day of the conference, HP’s Dwight Barron gave an overview of their Moonshot system. They have been refining the specifications since its late 2009 inauguration. Moonshot’s design differs from the traditional servers which have been the general-purpose workhorses of the data center. These boxes have proved to be jacks-of-all-trades, able to run operations for organizations of every shape and size. They started with proprietary operating systems and a

Intel's New Knight's Landing Xeon Phi Combines Omni Scale Fabric with HMC

HP Moonshot Using ARM 64-bit SoC

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