Couple of days ago, GlobalFoundries issued a press release stating that they ‘demonstrated silicon success on the first AMD (NASDAQ: AMD) products using GLOBALFOUNDRIES’ most advanced 14nm FinFET process technology.’ “FinFET technology is expected to play a critical foundational role across multiple AMD product lines, starting in 2016. GLOBALFOUNDRIES has worked tirelessly to reach this key milestone on its 14LPP process. We look forward to GLOBALFOUNDRIES’ continued progress towards full production readiness and expect to leverage the advanced 14LPP process technology across a broad set of our CPU, APU, and GPU products,” said Mark Papermaster, Senior Vice President and Chief Technology Officer at Advanced Micro Devices.
Since its inception, GlobalFoundries had a plan to become world’s leading semiconductor manufacturer. From starting as an AMD manufacturing spin-off, the company owners set a multi-decade plan which involved acquiring Chartered Semiconductor and recently, acquired IBM foundry business as well. The capacity grew from initial 60,000 300mm wafers in 2009 to almost quarter billion 300mm and 130+ million 200mm wafers in second quarter of 2015. While the absolute capacity numbers were even higher, the owners (Mubadala Development Company, Abu Dhabi) decided to re-address the capacity and increase volume in processes that make financial sense. In order to stay ahead the company kept on investing in SOI
A statement from Ultratech’s CEO appears to support rumors of a big delay from Samsung.
As Samsung seems to complete its move to a 20nm manufacturing process, TSMC is aiming to shift to a 10 nm process node by the end of 2015.
On Thursday (LON: ARM) and Taiwan Semiconductor Manufacturing Corporation (TPE: 2330) announced a plan to deliver ARM-based processors on TSMC 10FinFET process node. The two companies said that their roadmap would place the release of the 10nm chips in the fourth quarter of 2015. In the announcing press release, the companies said that the success of the transition from 20nm to 16FinFET influenced their decision to work together again on the deal. As announced at Computex in June, ARM is building a research and innovation center in Hsinchu, Taiwan home to the headquarters of TSMC and MediaTek. “ARM and TSMC are industry leaders in our
Today’s announcement from the well-known full service semiconductor company, Global Foundries and QuickLogic (NASDAQ:QUIK), will interest those looking for ultra low power (ULP) sensor hubs. The new ArcticLink 3 S2 is optimized for smartphones and the new wearable devices. QuickLogic is known as being an innovator of ultra low power programmable Customer Specific Standard Products — silicon platforms plus software solutions. Its next generation ArcticLink 3 S2 platform is sampling on Global Foundries own lower power 65 nanometer process technology. Global Foundries also prides itself on its 14nm FinFET leading edge technologies fashioned for high-volume, high-performance and power-efficient SoC applications. Sensor hubs like the 3 S2
Samsung and Globalfoundries have announced a partnership to collaborate on a global scale to deliver 14nm FinFET technology to their customers. This partnership is different from the already existing Common Platform Alliance which includes Globalfoundries, Samsung and IBM, but is likely a product of that relationship considering that IBM is mostly a research fab and doesn’t really produce many commercial wafers. This 14nm FinFET collaboration is an effort by both companies to build up enough fab capacity in order to satisfy the demand of their customers on this leading-edge technology. As you can see from the slide above Samsung and Globalfoundries’ partnership means that the