AMD’s decision to rename and split the Northern Islands family into two is starting to unravel itself. Polaris 10 (Ellesmere) and 11 (Baffin) are coming to market as low-power mainstream cards – Radeon RX460 (Polaris 11), RX470, RX480 4GB and RX480 8GB (all Polaris 1o). On the other side, Greenland i.e. Vega 10 will be the most advanced silicon AMD has ever produced. Featuring 14nm FinFET design by GlobalFoundries or Samsung, with SK.Hynix HBM2 memory modules on multi-chip-module, i.e. MCM (TSMC calls this CoWoS), Vega 10 is looking to offer equal or higher performance than the high-end GP100. You should expect the chip to land in between
2016 will be marked with the arrival of two memory standards, which should spread across the mainstream and high-end / enthusiast line-up like fire. First, we have the HBM2, an improved version of HBM memory which debuted (and so far, only ships inside) with AMD R9 Fury family of cards. HBM2 promises a four times increase in capacity and double the memory bandwith – meaning a single card can go from 4GB and 512GB/s to 16GB and 1TB/s. Given the low volume of HBM and HBM2 memory, those two will probably remain only on enthusiast graphics cards, such as recently renamed Greenland, high-end Polaris graphics processor from AMD
Back in early December 2015, AMD invited their preferred media partners to brief them about the new company structure, where Radeon Technology Group (RTG, also known as ATI 2.0) will continue to bring products to market under the AMD banner until the (almost inevitable) spin-off occurs. In a run-up to CES 2016, which takes place in Las Vegas, NV, AMD made a formal announcement introducing the Polaris GPU architecture. In a video bewlo, Raja Koduri (head of RTG) spoke of innovation that was enabled by a logical transition from planar transistors (single-gate, i.e. 2-D) to multi-gate (i.e. 3-D) technology, with a variant of 3-D transistors being called FinFET. If
According to HotHardware, Samsung is set to produce of 14nm chips for AMD, starting next year. This news comes as a bit of a surprise. AMD currently produces all its chips through one company, namely GlobalFoundries. In a nutshell, AMD now keeps all of their chip production with one single company – not a good business model in any situation. Taiwan Semiconductor Manufacturing Company (TSMC) also used to build chips for AMD. But after yield and supply woes were constantly happening, it forced AMD to look elsewhere for help, and right now it’s looking in the direction of Samsung. The idea is to have at least
Couple of days ago, GlobalFoundries issued a press release stating that they ‘demonstrated silicon success on the first AMD (NASDAQ: AMD) products using GLOBALFOUNDRIES’ most advanced 14nm FinFET process technology.’ “FinFET technology is expected to play a critical foundational role across multiple AMD product lines, starting in 2016. GLOBALFOUNDRIES has worked tirelessly to reach this key milestone on its 14LPP process. We look forward to GLOBALFOUNDRIES’ continued progress towards full production readiness and expect to leverage the advanced 14LPP process technology across a broad set of our CPU, APU, and GPU products,” said Mark Papermaster, Senior Vice President and Chief Technology Officer at Advanced Micro Devices.
At the recently held 2015 HotChips conference, Avinash Sodani (KNL Chief Architect, Senior Principal Engineer, Intel) gave a speech how Intel plans to expand the Xeon Phi product lineup from a server-only, PCIe card concept into three different packages, which would appeal to the workstation and server customers in different fields. On SC’15 Conference, which takes place in Austin, TX – Intel finally confirmed the strategy and is coming out with a workstation product that will feature a fully-enabled Knights Landing (KNL) Many-Core processor. In the first half of 2016, the company will ship Intel-built, Intel-branded workstation powered by self-booting Xeon Phi processor. The processor will be able to boot standard