Breaking, Graphics, News, Virtual Reality (VR)

GDDR5X Memory Shows Better Than Expected Results

Micron GDDR5X memory.

2016 will be marked with the arrival of two memory standards, which should spread across the mainstream and high-end / enthusiast line-up like fire. First, we have the HBM2, an improved version of HBM memory which debuted (and so far, only ships inside) with AMD R9 Fury family of cards. HBM2 promises a four times increase in capacity and double the memory bandwith – meaning a single card can go from 4GB and 512GB/s to 16GB and 1TB/s. Given the low volume of HBM and HBM2 memory, those two will probably remain only on enthusiast graphics cards, such as recently renamed Greenland, high-end Polaris graphics processor from AMD


AMD, Business, CPU, Enterprise, Graphics, Hardware, Intel, Nvidia

Intel Moves to Attack NVIDIA Quadro, AMD FirePro Market

Intel Xeon Phi "Knights Landing" Chip Package

At the recently held 2015 HotChips conference, Avinash Sodani (KNL Chief Architect, Senior Principal Engineer, Intel) gave a speech how Intel plans to expand the Xeon Phi product lineup from a server-only, PCIe card concept into three different packages, which would appeal to the workstation and server customers in different fields. On SC’15 Conference, which takes place in Austin, TX – Intel finally confirmed the strategy and is coming out with a workstation product that will feature a fully-enabled Knights Landing (KNL) Many-Core processor. In the first half of 2016, the company will ship Intel-built, Intel-branded workstation powered by self-booting Xeon Phi processor. The processor will be able to boot standard


Business, Companies, Hardware, Intel, VR World

Intel Gunning To Challenge Nvidia At HPC With ‘Knights Landing’ Xeon Phi Processor

Knights Landing

Intel’s Knights Landing is set to offer three times the amount of performance as the current-gen Knights Corner.


Cloud Computing, Enterprise, Hardware, VR World

Intel's New Knight's Landing Xeon Phi Combines Omni Scale Fabric with HMC

Knight's Landing

Today, Intel made two fairly large announcements simultaneously with the announcement of their Omni Scale Fabric and the integration of it into their next generation of Xeon Phi chips. Additionally, Intel has worked with Micron to enhance Knight’s Landing with high-performance on-package memory. This on-package memory is also known as Hybrid Memory Cube or HMC. The Knight’s Landing next generation Xeon Phi product announced today will use Intel’s Silvermont CPU architecture which is modified (or as Intel says, enhanced) for HPC. The expectation that Intel is setting is that these cores will deliver three times the single threaded performance of the previous generation and still