Slides from AMD’s (NASDAQ:AMD) event at the PC Cluster Consortium event in Osaka, Japan offer up details regarding the chip vendor’s roadmap for its GPUs and CPUs, with the takeaways including the launch of a 300W APU targeted at the HPC segment along with the launch of new CPU cores.
At the event, Junji Hayashi, Consumer and Commercial Business Lead at AMD Japan, shared details on the vendor’s K12 ARM as well as the x86 Zen CPU cores. AMD is looking to introduce both ARM as well as traditional x86 cores in a pin compatible platform that is codenamed SkyBridge. Aimed at the server, embedded, semi-custom and client markets, both the ARMv8 and the x86-powered cores will offer 64-bit computing and will be manufactured using a 14-nm FinFET process. SkyBridge will be launching before the end of the year, although an exact launch window was not provided.
The K12 core will feature Simultaneous Multi-Threading, which is a departure from the Clustered Multi-Thread technology that is currently utilized in AMD’s offerings. SMT will offer larger CPU cores the ability to achieve a higher throughput by allocating underutilized resources to an additional, slower, execution thread.
As for GPUs, Hayashi mentioned that AMD would be moving to a two-year release cadence cycle for updating the GPU architecture of APUs. There was also a mention of a High Performance Computing APU, which is said to be radically different from existing designs in that is features the Stacked HBM (High Bandwidth Memory) memory standard. The HPC APUs will slot in between the standard server cores and the FirePro line of cards.
The current generation HBM is nine times faster than GDDR5 memory and 128 times faster than DDR3. AMD is said to be utilizing the same standard in its Radeon 300 series, with the technology itself developed in collaboration with SK Hynix.