Given the slow disintegration or refocusing of its competitors, we were not all too surprised when Intel started to slow down its famous “Tick-Tock” manufacturing cadence. Originally introduced in 2006 with the “Conroe”, Core 2 Duo processors, Tick-Tock was mixed between a new microarchitecture and current manufacturing process (Tock), and a new process, die-shrink processor with some architectural optimizations (Tick). Further separation in Tick-Tock was a cadence between mainstream parts (desktop, mobile) and high-end parts (gaming, workstations) – Tick or Tock would always debut as mainstream parts, followed by high-end 6-12 months after. High end would typically mean Intel Xeon and Core i7 ‘X’ line-up.
The guys over at VR-Zone have scored what appears to be a roadmap document that details the changeover from Broadwell and Haswell over to Skylake. In the document, there is a vast amount of information, including the disclosure of the fact that there will be one chipset for consumer and server. This may ultimately mean that consumers will no longer have to suffer with inferior chipsets and enterprise won’t lose certain features that aren’t deemed ‘enterprise’. Not to mention, by having one chipset for both consumer and server, Intel can drive better volumes of that single chip and improve inefficiencies and profitability. If you